Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers



FIG. 1 is front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view thereof taken through line 8—8 of FIG. 6;

FIG. 9 is a cross-sectional view thereof taken through line 9—9 of FIG. 6; and,

FIG. 10 is a front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design. 

The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described. 